Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/04/2020
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Application #:
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16267370
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Filing Dt:
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02/04/2019
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Publication #:
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Pub Dt:
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06/13/2019
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Inventors:
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Chia-Yang Chang, Teng-Sheng Chen, Yi Qin
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Title:
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INTERPOSER AND CHIP-SCALE PACKAGING FOR WAFER-LEVEL CAMERA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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4275 BURTON DRIVE |
SANTA CLARA, CALIFORNIA 95054 |
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LATHROP GAGE LLP |
2440 JUNCTION PLACE, SUITE 300 |
BOULDER, CO 80301 |
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