Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/18/2020
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Application #:
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15563263
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Filing Dt:
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09/29/2017
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Publication #:
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Pub Dt:
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04/05/2018
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Inventors:
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Takumi TOIDA, Masatoshi ECHIGO, Takashi MAKINOSHIMA
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Title:
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COMPOUND, RESIN, AND PURIFICATION METHOD THEREOF, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM, AND UNDERLAYER FILM, AS WELL AS RESIST PATTERN FORMING METHOD AND CIRCUIT PATTERN FORMING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-2, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8324 |
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| FITCH, EVEN, TABIN & FLANNERY, LLP |
| 120 SOUTH LASALLE STREET, SUITE 2100 |
| CHICAGO, IL 60603-3406 |
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