Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/18/2020
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Application #:
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16201959
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Filing Dt:
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11/27/2018
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Publication #:
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Pub Dt:
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12/26/2019
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Inventors:
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CHIA-WEI CHEN, SHIN-WEN CHEN
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Title:
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ENCAPSULATION STRUCTURE FOR IMAGE SENSOR CHIP AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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B2 BUILDING FOXCONN TECHNOLOGY GROUP,DONGHUAN 2ND ROAD,LONGHUA TOWN |
SHENZHEN, CHINA |
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KYOKO C. MAKINO |
550 S. HOPE STREET, SUITE 2825 |
LOS ANGELES, CA 90071 |
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09/23/2024 05:44 AM
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