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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/08/2020
Application #:
16454435
Filing Dt:
06/27/2019
Inventors:
Ling-Wei LI, Cheng-Lin HUANG, Jung-Hua CHANG
Title:
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
Assignment: 1
Reel/Frame:
049893/0861Recorded: 07/29/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/05/2019
Exec Dt:
07/05/2019
Exec Dt:
07/05/2019
Assignee:
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22042

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