Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/2020
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Application #:
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16397157
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Filing Dt:
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04/29/2019
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Publication #:
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Pub Dt:
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05/07/2020
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Inventor:
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Heng LIU
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Title:
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METHOD OF MAKING AN INTERCONNECTION BETWEEN WAFERS AFTER WAFER LEVEL STACKING, BASED ON 3D-IC TECHNOLOGY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 18 GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, |
| WUHAN, HUBEI, CHINA 430205 |
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| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 4000 LEGATO RD., SUITE 310 |
| FAIRFAX, VA 22033 |
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