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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
10788370
Issue Dt:
09/29/2020
Application #:
15777742
Filing Dt:
05/21/2018
Publication #:
20180335347
Pub Dt:
11/22/2018
Inventors:
Christian SCHMIDT, Wilhelm LENEKE, Frank HERRMANN, Jörg SCHIEFERDECKER, Bodo FORG et al
Title:
THERMAL INFRARED SENSOR ARRAY IN WAFER-LEVEL PACKAGE
Assignment: 1
Reel/Frame:
046102/0225Recorded: 06/15/2018Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HERRMANN, FRANK
Exec Dt:
06/04/2018
SCHMIDT, CHRISTIAN
Exec Dt:
05/23/2018
SCHIEFERDECKER, JÖRG
Exec Dt:
06/04/2018
LENEKE, WILHELM
Exec Dt:
05/25/2018
FORG, BODO
Exec Dt:
06/04/2018
SIMON, MARION
Exec Dt:
05/25/2018
SCHNORR, MICHAEL
Exec Dt:
05/25/2018
Assignee:
HEIMANN SENSOR GMBH
MARIA-REICHE-STR. 1
DRESDEN, GERMANY 01109
Correspondent:
JEFF ROTHENBERG, ESQ.
5 COLUMBIA CIRCLE
HESLIN ROTHENBERG FARLEY & MESITI P.C.
ALBANY, NY 12193

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