Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/06/2020
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Application #:
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16221683
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Filing Dt:
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12/17/2018
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Publication #:
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Pub Dt:
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06/18/2020
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Inventors:
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You QIAN, Humberto CAMPANELLA PINEDA, Rakesh KUMAR
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Title:
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MICROELECTROMECHANICAL SYSTEMS PACKAGES AND METHODS FOR PACKAGING A MICROELECTROMECHANICAL SYSTEMS DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
SINGAPORE, SINGAPORE 738406 |
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VIERING, JENTSCHURA & PARTNER MBB |
C/O 444 BRICKELL AVENUE. |
SUITE 51270 |
MIAMI, FL 33131 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1 TAMPINES INDUSTRIAL AVENUE 5 |
SINGAPORE, SINGAPORE |
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WINSTON HSU |
5F., NO.389, FUHE RD., YONGHE DIST., |
NEW TAIPEI CITY, TAIWAN |
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09/26/2024 05:14 AM
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