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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/13/2020
Application #:
16199540
Filing Dt:
11/26/2018
Publication #:
Pub Dt:
03/28/2019
Inventors:
Sheng-Hsiung Chen, Chung-Hsing Wang, Fong-yuan Chang, Lee-Chung Lu, Li-Chun Tien et al
Title:
Integrated Circuit Having a High Cell Density
Assignment: 1
Reel/Frame:
047579/0867Recorded: 11/26/2018Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Exec Dt:
03/17/2017
Exec Dt:
03/17/2017
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Exec Dt:
03/10/2017
Assignee:
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
JONES DAY
250 VESEY STREET
NEW YORK, NY 10281-1047

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