Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/20/2020
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Application #:
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16117923
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Filing Dt:
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08/30/2018
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Publication #:
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Pub Dt:
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02/28/2019
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Inventors:
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Sung Il KANG, In Seob BAE, Jea Won KIM
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE SUBSTRATE MANUFACTURED USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 726, UNGNAM-RO, SEONGSAN-GU |
| GYEONGSANGNAM-DO |
| CHANGWON-SI, KOREA, REPUBLIC OF 51552 |
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| SCHWABE WILLIAMSON & WYATT, PC |
| 1211 SW FIFTH AVE. |
| SUITE 1900 |
| PORTLAND, OR 97204 |
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