Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/27/2020
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Application #:
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16550279
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Filing Dt:
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08/25/2019
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Inventors:
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Chao YAN, Yiwen LU, Jun LIU
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Title:
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PACKAGING STRUCTURE FOR POWER MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1F&7F&8F, BUILDING 1, NO.1675 HUADONG ROAD, PUDONG |
SHANGHAI, CHINA 201209 |
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CKC & PARTNERS CO., LLC |
12345 LAKE CITY WAY NE, NO. 283 |
SEATTLE, WA 98125 |
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09/24/2024 05:22 AM
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