Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/27/2020
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Application #:
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16262924
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Filing Dt:
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01/31/2019
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Publication #:
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Pub Dt:
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08/06/2020
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Inventors:
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Sen-Kuei Hsu, Hsin-Yu Pan, Yi-Che Chiang
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Title:
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SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 30078 |
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JCIPRNET |
P.O. BOX 600 TAIPEI GUTING |
TAIPEI CITY, 10099 TAIWAN |
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09/25/2024 07:24 PM
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