Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/10/2020
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Application #:
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16727126
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Filing Dt:
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12/26/2019
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Publication #:
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Pub Dt:
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05/07/2020
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Inventors:
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Wei-Hung Lin, Chun-Cheng Lin, Ming-Da Cheng, Kuei-Wei Huang, Chih-Wei Lin, Meng-Tse Chen et al
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Title:
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PACKAGING METHODS FOR SEMICONDUCTOR DEVICES COMPRISING FORMING TRENCHES IN SEPARATION REGIONS BETWEEN ADJACENT PACKAGING SUBSTRATES
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP |
17950 PRESTON RD., SUITE 1000 |
DALLAS, TX 75252 |
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05/28/2024 08:32 AM
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