Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/10/2020
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Application #:
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15679789
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Filing Dt:
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08/17/2017
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Inventors:
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Sergey K. Tolpygo, Denis Amparo, Richard Hunt, John Vivalda, Daniel Yohannes
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Title:
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SYSTEM AND METHOD FOR PROVIDING MULTI-CONDUCTIVE LAYER METALLIC INTERCONNECTS FOR SUPERCONDUCTING INTEGRATED CIRCUITS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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175 CLEARBROOK ROAD |
ELMSFORD, NEW YORK 10523 |
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OSTROLENK FABER LLP |
1180 AVENUE OF THE AMERICAS |
NEW YORK, NY 10036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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175 CLEARBROOK RD |
#148 |
ELMSFORD, NEW YORK 10523 |
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STEVEN M. HOFFBERG |
777 THIRD AVE |
22ND FL |
NEW YORK, NY 10017 |
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