Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/17/2020
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Application #:
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16578554
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Filing Dt:
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09/23/2019
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Publication #:
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Pub Dt:
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01/16/2020
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Inventors:
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Richard M. Hartman, Paul J. Macioce, Robert W. Tait, George H. Ransford
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Title:
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DENSIFIED FOAM FOR THERMAL INSULATION IN ELECTRONIC DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 600 SOUTH MCCLURE ROAD |
| MODESTO, CALIFORNIA 95357 |
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| BOTKIN & HALL, LLP |
| 1003 NORTH HICKORY |
| SOUTH BEND, IN 46615 |
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