Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/24/2020
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Application #:
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16102533
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Filing Dt:
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08/13/2018
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Publication #:
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Pub Dt:
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02/28/2019
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Inventors:
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Zhiyuan WU, Meng Chu TSENG, Mehul B. NAIK, Ben-Li SHEU
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Title:
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SEED LAYERS FOR COPPER INTERCONNECTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3050 BOWERS AVENUE |
SANTA CLARA, CALIFORNIA 95054 |
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KEITH TABOADA |
24 GREENWAY PLAZA, SUITE 1600 |
HOUSTON, TX 77046 |
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