Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2020
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Application #:
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16059221
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Filing Dt:
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08/09/2018
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Publication #:
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Pub Dt:
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02/14/2019
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Inventors:
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Hongqiang Han, WenYu Liu, Hongwen Yang, Youwei Pan, Lizhou Li
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Title:
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Clamping Mechanism For Heat Sink and Electronic Device Assembly Including the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SECTIONS F AND G, LEVEL 1, BUILDING 15 |
NO. 999 YINGLUN ROAD, CHINA (SHANGHAI) PILOT FREE TRADE ZONE |
SHANGHAI, CHINA |
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BARLEY SNYDER |
2 GREAT VALLEY PARKWAY |
SUITE 110 |
MALVERN, PA 19355 |
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