Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/15/2020
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Application #:
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16919447
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Filing Dt:
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07/02/2020
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Publication #:
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Pub Dt:
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10/22/2020
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Inventor:
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WANG-LAI YANG
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Title:
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CHIP PACKAGES AND METHODS FOR FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.9 JIANYE EAST ROAD,,ZHONGSHAN TORCH DEVELOPMENT ZONE |
| ZHONGSHAN, CHINA |
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| TUNG-YUN MCNALLY |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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