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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/15/2020
Application #:
15860492
Filing Dt:
01/02/2018
Inventors:
Chih-Chang HUNG, Ming-Ching CHANG, Yi-Hsuan HSIAO, Chia-Jen CHEN, Shu-Yuan KU, I-Wei YANG
Title:
SEMICONDUCTOR STRUCTURE CUTTING PROCESS AND STRUCTURES FORMED THEREBY
Assignment: 1
Reel/Frame:
045824/0858Recorded: 05/16/2018Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/05/2018
Exec Dt:
01/08/2018
Exec Dt:
01/05/2018
Exec Dt:
01/05/2018
Exec Dt:
03/25/2018
Exec Dt:
01/08/2018
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
PATTERSON & SHERIDAN, LLP
24 GREENWAY PLAZA
SUITE 1600
HOUSTON, TX 77046

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