Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/05/2021
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Application #:
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17023967
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Filing Dt:
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09/17/2020
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Publication #:
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Pub Dt:
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01/07/2021
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Inventors:
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Chun-Hung Chen, Ming-Tse Lin, Chu-Fu Lin
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO3, LI-HSIN RD.II, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30078 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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