Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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16275131
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Filing Dt:
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02/13/2019
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Inventor:
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Beng Beng Lim
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Title:
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PACKAGE STRUCTURE AND POWER MODULE USING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4 KAKI BUKIT AVENUE 1, #05 - 04 |
| SINGAPORE, SINGAPORE 417939 |
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| EVAN R. WITT KIRTON & MCCONKIE |
| 36 SOUTH STATE STREET, SUITE 1900 |
| SALT LAKE CITY, UT 84111 |
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