Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
02/02/2021
|
Application #:
|
16526020
|
Filing Dt:
|
07/30/2019
|
Publication #:
|
|
Pub Dt:
|
10/01/2020
| | | | |
Inventors:
|
Jin Won JEONG, Dong Ki SHIM, Jae Sik CHOI, Byeung Soo SONG, Jin Han BAE
|
Title:
|
METHOD OF FORMING AND PACKAGING SEMICONDUCTOR DIE
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
215, DAESIN-RO, HEUNGDEOK-GU |
CHUNGCHEONGBUK-DO |
CHEONGJU-SI, KOREA, REPUBLIC OF 28429 |
|
|
|
NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
|
|
Assignment:
2
|
|
|
|
NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
15F, 76 JIKJI-DAERO, 436BEON-GIL (JIKJI SMART TOWER), HEUNGDEOK-GU, CHUNGCHEONGBUK-DO |
CHEONGJU-SI, KOREA, REPUBLIC OF 28581 |
|
|
|
NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
|
|
Search Results as of:
06/20/2024 06:42 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|