Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/09/2021
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Application #:
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16017665
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Filing Dt:
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06/25/2018
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Publication #:
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Pub Dt:
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12/26/2019
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Inventors:
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CHIH HUNG CHEN, YING-LANG WANG, KEI-WEI CHEN
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Title:
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THICKNESS SENSOR FOR CONDUCTIVE FEATURES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 30078 |
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| SEED IP LAW GROUP LLP |
| 701 FIFTH AVENUE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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