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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	10916829	Issue Dt:	02/09/2021	Application #:	16233021	Filing Dt:	12/26/2018
Publication #:	20190198972	Pub Dt:	06/27/2019
Inventors:	Yenheng CHEN, Chengchung LIN, Chengtar WU
Title:	SEMICONDUCTOR PACKAGE STRUCTURE HAVING ANTENNA MODULE

Assignment: 1

Reel/Frame:

050754/0949

Recorded: 10/17/2019

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

CHEN, YENHENG

Exec Dt:

03/15/2019

WU, CHENGTAR

Exec Dt:

03/15/2019

LIN, CHENGCHUNG

Exec Dt:

03/15/2019

Assignee:

HUAIAN IMAGING DEVICE MANUFACTURER CORPORATION

78 CHANGSHAN AVENUE

HUAIYIN DISTRICT

HUAIAN, CHINA 214437

Correspondent:

ALSTON & BIRD LLP

BANK OF AMERICA PLAZA

101 SOUTH TRYON STREET, SUITE 4000

CHARLOTTE, NC 28280-4000

Assignment: 2

Reel/Frame:

053846/0078

Recorded: 09/22/2020

Pages: 6

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA FROM "HUAIAN IMAGING DEVICE MANUFACTURER CORPORATION" TO SJ SEMICONDUCTOR (JIANGYIN) CORPORATION" PREVIOUSLY RECORDED ON REEL 050754 FRAME 0949. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST..

Assignors:

CHEN, YENHENG

Exec Dt:

03/15/2019