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Patent Assignment Abstract of Title
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Total Assignments: 5
Patent #:
10920337
Issue Dt:
02/16/2021
Application #:
15855466
Filing Dt:
12/27/2017
Publication #:
20180179660
Pub Dt:
06/28/2018
Inventors:
Richard J. Phillips, Parthiv Daggolu, Eric Gitlin, Jae-Woo Ryu, HyungMin Lee et al
Title:
METHODS FOR FORMING SINGLE CRYSTAL SILICON INGOTS WITH IMPROVED RESISTIVITY CONTROL
Assignment: 1
Reel/Frame:
055205/0200Recorded: 02/02/2021Pages: 7
Conveyance:
EMPLOYMENT AGREEMENT
Assignor:
BASAK, SOUBIR
Exec Dt:
03/07/2011
Assignee:
MEMC ELECTRONIC MATERIALS, INC.
501 PEARL DRIVE
ST. PETERS, MISSOURI 63376
Correspondent:
RICHARD A. SCHUTH
ARMSTRONG TEASDALE LLP
7700 FORSYTH BLVD., SUITE 1800
ST. LOUIS, MO 63105
Assignment: 2
Reel/Frame:
055209/0053Recorded: 02/03/2021Pages: 3
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
MEMC ELECTRONIC MATERIALS, INC.
Exec Dt:
05/13/2013
Assignee:
SUNEDISON, INC.
501 PEARL DRIVE
ST. PETERS, MISSOURI 63376
Correspondent:
RICHARD A. SCHUTH
ARMSTRONG TEASDALE LLP
7700 FORSYTH BLVD., SUITE 1800
ST. LOUIS, MO 63105
Assignment: 3
Reel/Frame:
055209/0180Recorded: 02/03/2021Pages: 39
Conveyance:
SEPARATION AGREEMENT
Assignor:
SUNEDISON, INC.
Exec Dt:
05/27/2014
Assignee:
SUNEDISON SEMICONDUCTOR LIMITED
9 BATTERY ROAD
#15-01, STRAITS TRADING BUILDING
SINGAPORE, SINGAPORE 049910
Correspondent:
RICHARD A. SCHUTH
ARMSTRONG TEASDALE LLP
7700 FORSYTH BLVD., SUITE 1800
ST. LOUIS, MO 63105
Assignment: 4
Reel/Frame:
055209/0381Recorded: 02/03/2021Pages: 52
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SUNEDISON SEMICONDUCTOR LIMITED
Exec Dt:
06/06/2018
MEMC JAPAN LTD
Exec Dt:
06/06/2018
MEMC ELECTRONIC MATERIALS S.P.A
Exec Dt:
06/06/2018
Assignee:
GLOBALWAFERS CO., LTD.
NO. 8. INDUSTRIAL EAST ROAD
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C.
Correspondent:
RICHARD A. SCHUTH
ARMSTRONG TEASDALE LLP
7700 FORSYTH BLVD., SUITE 1800
ST. LOUIS, MO 63105
Assignment: 5
Reel/Frame:
055131/0877Recorded: 02/03/2021Pages: 13
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PHILLIPS, RICHARD J.
Exec Dt:
08/06/2018
DAGGOLU, PARTHIV
Exec Dt:
01/28/2019
GITLIN, ERIC MICHAEL
Exec Dt:
10/23/2018
STANDLEY, ROBERT W.
Exec Dt:
08/07/2018
LEE, HYUNGMIN
Exec Dt:
08/03/2018
ZHANG, NAN
Exec Dt:
10/12/2018
RYU, JAE-WOO
Exec Dt:
08/02/2018
Assignee:
GLOBALWAFERS CO., LTD.
NO. 8. INDUSTRIAL EAST ROAD
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C.
Correspondent:
RICHARD A. SCHUTH
ARMSTRONG TEASDALE LLP
7700 FORSYTH BLVD., SUITE 1800
ST. LOUIS, MO 63105

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