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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/16/2021
Application #:
16261601
Filing Dt:
01/30/2019
Publication #:
Pub Dt:
07/30/2020
Inventor:
Meng Shen
Title:
LOW-PROFILE, HIGH-POWER PUMP FOR ELECTRONICS FLUID COOLING SYSTEM
Assignment: 1
Reel/Frame:
048187/0950Recorded: 01/30/2019Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/21/2019
Assignee:
WEST INDUSTRIAL PARK, XINYANG COMMUNITY
SHAJING BRANCH, BAOAN DISTRICT
SHENZHEN, CHINA
Correspondent:
ASIA VITAL COMPONENTS (CHINA) CO., LTD.
7FL., NO. 283, SEC. 2, FUSHING S. RD.
TAIPEI, 106 TAIWAN

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