Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/16/2021
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Application #:
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16174022
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Filing Dt:
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10/29/2018
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Publication #:
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Pub Dt:
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04/30/2020
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Inventors:
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Lidia MOIOLI, Pasqualina FRAGNETO, Beatrice ROSSI, Diego CARRERA, Giacomo BORACCHI et al
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Title:
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WAFER MANUFACTURING SYSTEM, DEVICE AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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PIAZZA L. DA VINCI 32 |
MILANO, ITALY 20133 |
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SEED IP LAW GROUP LLP |
701 5TH AVENUE |
STE 5400 |
SEATTLE, WA 98104 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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VIA C. OLIVETTI, 2 |
AGRATE BRIANZA, ITALY 20864 |
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SEED IP LAW GROUP LLP |
701 5TH AVENUE |
STE 5400 |
SEATTLE, WA 98104 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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VIA C. OLIVETTI, 2 |
AGRATE BRIANZA, ITALY 20864 |
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SEED IP LAW GROUP LLP |
701 FIFTH AVENUE |
SUITE 5400 |
SEATTLE, WA 98104 |
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09/23/2024 06:50 AM
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