Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/23/2021
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Application #:
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16208307
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Filing Dt:
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12/03/2018
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Publication #:
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Pub Dt:
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04/18/2019
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Inventor:
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Mengbin LIU
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Title:
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PACKAGING METHOD AND PACKAGE STRUCTURE OF WAFER-LEVEL SYSTEM-IN-PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT |
| SHANGHAI, CHINA |
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| ANOVA LAW GROUP C/O SMIC |
| 21495 RIDGETOP CIRCLE |
| SUITE 300 |
| STERLING, VA 20166 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE TYPO ON THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED ON REEL 047662 FRAME 0810. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT |
| NINGBO, CHINA |
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| ANOVA LAW GROUP, PLLC |
| 21495 RIDGETOP CIRCLE, SUITE 300 |
| STERLING, VA 20166 |
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