Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/23/2021
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Application #:
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16163274
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Filing Dt:
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10/17/2018
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Publication #:
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Pub Dt:
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02/20/2020
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Inventors:
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Jun CHEN, Zhiliang XIA, Li Hong XIAO
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Title:
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Embedded Pad Structures of Three-Dimensional Memory Devices and Fabrication Methods Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18 GAOXIN 4TH ROAD |
| EAST LAKE HIGH-TECH DEVELOPMENT ZONE |
| WUHAN, HUBEI, CHINA 430074 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C. |
| 1100 NEW YORK AVENUE, NW |
| WASHINGTON, DC 20005 |
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