Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/02/2021
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Application #:
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16455850
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Filing Dt:
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06/28/2019
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Publication #:
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Pub Dt:
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12/31/2020
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Inventors:
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Yi-Wen Chen, Cheng-Ting Shih
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Title:
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Implant Surface Mapping and Unwrapping Method
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 91, XUESHI RD., NORTH DIST. |
TAICHUNG CITY 404, TAIWAN ROC |
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NO. 2, YUDE RD., NORTH DIST. |
TAICHUNG CITY 404, TAIWAN ROC |
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MAYER & WILLIAMS, P.C. |
55 MADISON AVENUE, SUITE 400 |
MORRISTOWN, NJ 07960 |
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09/24/2024 08:47 PM
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