Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/02/2021
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Application #:
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16193691
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Filing Dt:
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11/16/2018
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Inventors:
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DeokKyung Yang, HunTeak Lee, HeeSoo Lee, Wanil Lee, SangDuk Lee
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Title:
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Molded Laser Package with Electromagnetic Interference Shield and Method of Making
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 ANG MO KIO STREET 65 |
| TECHPOINT #04-08/09 |
| SINGAPORE, SINGAPORE 569059 |
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| STATS CHIPPAC/PATENT LAW GROUP: ATKINS A |
| 55 N. ARIZONA PLACE, SUITE 104 |
| CHANDLER, AZ 85225 |
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