Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/30/2021
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Application #:
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16099129
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Filing Dt:
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11/05/2018
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Publication #:
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Pub Dt:
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09/17/2020
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Inventor:
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Sung Hwan KIM
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Title:
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UPPER MOLD FOR MLCC LAMINATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 100, MANNYEON-RO 151-BEON-GIL, HYANGNAM-EUP, HWANSEONG-SI, |
| GYEONGGI-DO, KOREA, REPUBLIC OF 18625 |
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| IPLA P.A. |
| 3580 WILSHIRE BLVD. |
| 17TH FLOOR |
| LOS ANGELES, CA 90010 |
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