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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/30/2021
Application #:
15960790
Filing Dt:
04/24/2018
Publication #:
Pub Dt:
11/01/2018
Inventors:
Eiichi YAMAMOTO, Yoshihiro TERAKUBO, Takahiko MITSUI, Toshihiro ITO
Title:
ELECTROSTATIC ATTACHMENT CHUCK, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Assignment: 1
Reel/Frame:
045620/0097Recorded: 04/24/2018Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/17/2018
Exec Dt:
04/17/2018
Exec Dt:
04/17/2018
Exec Dt:
04/17/2018
Assignee:
2993, GOBARA, ANNAKA-SHI
GUNMA, JAPAN 379-0135
Correspondent:
RANKIN, HILL & CLARK LLP
23755 LORAIN ROAD, SUITE 200
NORTH OLMSTED, OH 44070

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