Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/30/2021
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Application #:
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16454143
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Filing Dt:
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06/27/2019
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Publication #:
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Pub Dt:
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08/27/2020
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Inventors:
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LI-CHUN HUNG, CHIEN-CHEN LEE, HSIU-WEN TU
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Title:
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CHIP-SCALE SENSOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.84, TAI-HO RD., CHU-PEI |
HSIN-CHU COUNTY, TAIWAN 302 |
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LI&CAI INTELLECTUAL PROPERTY(USA) OFFICE |
3057 NUTLEY STREET |
SUITE 818 |
FAIRFAX, VA 22031 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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6F., NO. 83, YANPING S. RD., ZHONGZHENG DIST. |
TAIPEI CITY, TAIWAN 100011 |
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MCCLURE, QUALEY & RODACK LLP |
280 INTERSTATE NORTH CIRCLE |
SUITE 550 |
ATLANTA, GA 30339 |
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09/25/2024 11:45 AM
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