Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/27/2021
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Application #:
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16779660
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Filing Dt:
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02/02/2020
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Inventors:
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Da-Jung Chen, Chun-Tiao Liu, Chau-Chun Wen
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Title:
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THREE-DIMENSIONAL PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, R&D 2ND RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| MIN-LEE TENG |
| 11F-2, NO.248, SEC.3, NAN-JING E. RD. |
| TAIPEI, 105 TAIWAN |
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