Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/11/2021
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Application #:
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16485183
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Filing Dt:
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08/12/2019
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Publication #:
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Pub Dt:
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02/06/2020
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Inventors:
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Soichi SAKAMOTO, Junji FUJINO, Hiroshi KAWASHIMA, Taketoshi MAEDA
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Title:
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PACKAGING OF A SEMICONDUCTOR DEVICE WITH DUAL SEALING MATERIALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8310 |
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| BUCHANAN, INGERSOLL & ROONEY PC |
| POST OFFICE BOX 1404 |
| ALEXANDRIA, VA 22313-1404 |
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