Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/11/2021
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Application #:
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16529639
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Filing Dt:
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08/01/2019
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Publication #:
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Pub Dt:
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02/04/2021
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Inventors:
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Muhammad S. Islam, Enisa Harris, Suzana Prstic, Sergio Chan Arguedas, Sachin Deshmukh et al
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Title:
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MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
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| GREEN, HOWARD, & MUGHAL LLP. |
| 5 CENTERPOINTE DRIVE |
| SUITE 400 |
| LAKE OSWEGO, OR 97035 |
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