Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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05/25/2021
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Application #:
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15823737
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Filing Dt:
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11/28/2017
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Publication #:
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Pub Dt:
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03/22/2018
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Inventors:
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Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
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Title:
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LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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LAW OFFICE OF KEVIN JACKSON |
6315 E. CACTUS WREN RD |
PARADISE VALLEY, AZ 85253 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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333 SOUTH HOPE STREET |
19TH FLOOR |
LOS ANGELES, CALIFORNIA 90071 |
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MCGUIREWOODS LLP |
1750 TYSONS BOULEVARD |
SUITE 1800 |
TYSONS, VA 22102 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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491 B RIVER VALLEY ROAD |
#15-02/04 |
VALLEY POINT, SINGAPORE 248373 |
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MCANDREWS, HELD & MALLOY, LTD. |
500 WEST MADISON STREET |
34TH FLOOR |
CHICAGO, IL 60661 |
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09/19/2024 10:14 PM
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