Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
05/25/2021
|
Application #:
|
16423104
|
Filing Dt:
|
05/27/2019
|
|
Publication #:
|
|
Pub Dt:
|
12/03/2020
| | | | |
|
Inventors:
|
Rongwei Zhang, James Huckabee, Vikas Gupta
|
|
Title:
|
WAFER LEVEL DERIVED FLIP CHIP PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 12500 TI BOULEVARD |
| MS3999 |
| DALLAS, TEXAS 75243 |
|
|
|
|
| TEXAS INSTRUMENTS INCORPORATED |
| P O BOX 655474, M/S 3999 |
| DALLAS, TX 75265 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
CORRECTIVE ASSIGNMENT TO CORRECT THE REVERSED NAME OF RONGWEI ZHANG ON THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 04928 FRAME: 0090. ASSIGNOR(S) HEREBY CONFIRMS THE ASIGNMENT.
|
|
|
|
|
|
|
|
|
| 12500 TI BOULEVARD, M/S 3999 |
| DALLAS, TEXAS 75243 |
|
|
|
|
| TEXAS INSTRUMENTS INCORPORATED |
| P.O. BOX 655474 |
| M/S 3999 |
| DALLAS, TX 75265 |
|
|
Search Results as of:
05/24/2024 06:37 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
