Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/22/2021
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Application #:
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16876394
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Filing Dt:
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05/18/2020
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Inventors:
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Gang ZHAO, Shiann-Ming Liou, Lin CHEN, Wei Jiang
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Title:
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SEMICONDUCTOR DIE WITH HYBRID WIRE BOND PADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BLDG 1, FL 2, LANE 500 SHENGXIA ROAD |
| ZHANGJIANG, PUDONG NEW DISTRICT |
| SHANGHAI, CHINA |
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| IPRO, PLLC |
| 12332 TOWNCENTER PLAZA |
| PMB# 816 |
| STERLING, VA 20164 |
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05/30/2024 08:38 PM
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