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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/29/2021
Application #:
16437675
Filing Dt:
06/11/2019
Publication #:
Pub Dt:
05/28/2020
Inventors:
Mee-Hyun LIM, Sung-Yeol KIM, Seong-Keun CHO, Won-Don JOO, Jae-Hong KIM, Taek-Jin KIM et al
Title:
METHOD OF TESTING AN INTERCONNECTION SUBSTRATE AND APPARATUS FOR PERFORMING THE SAME
Assignment: 1
Reel/Frame:
049435/0389Recorded: 06/11/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/09/2019
Exec Dt:
05/09/2019
Exec Dt:
05/09/2019
Exec Dt:
05/09/2019
Exec Dt:
05/09/2019
Exec Dt:
05/09/2019
Exec Dt:
05/09/2019
Exec Dt:
05/09/2019
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
LEE & MORSE, P.C.
3141 FAIRVIEW PARK DRIVE
SUITE 500
FALLS CHURCH, VA 22042

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