Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/06/2021
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Application #:
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16883210
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Filing Dt:
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05/26/2020
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Publication #:
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Pub Dt:
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09/10/2020
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Inventors:
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Jie CHEN, Ying-Ju CHEN, Hsien-Wei CHEN, Der-Chyang YEH, Chen-Hua YU
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Title:
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REDISTRIBUTION LAYER STRUCTURES FOR INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C. |
| 1100 NEW YORK AVENUE, N.W. |
| WASHINGTON, DC 20005 |
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