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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/13/2021
Application #:
16629162
Filing Dt:
01/07/2020
Publication #:
Pub Dt:
10/01/2020
Inventors:
Zhihua LIU, Peng WEI, Yi ZHAO, Junmin ZHU, Hexiang YAN, Qi CHEN
Title:
THERMALLY CONDUCTIVE COMPOSITION
Assignment: 1
Reel/Frame:
056564/0001Recorded: 06/16/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/14/2018
Exec Dt:
09/14/2018
Exec Dt:
09/14/2018
Exec Dt:
10/29/2018
Exec Dt:
09/20/2018
Exec Dt:
09/20/2018
Assignee:
NO 936 ZHANGHENG ROAD
ROOM01, AREA 1, FLOOR 2, BUILDING 3
SHANGHAI FREE TRADE PILOT ZONE, CHINA
Correspondent:
BARB PROSS
2211 H.H. DOW WAY
MIDLAND, MI 48674
Assignment: 2
Reel/Frame:
056564/0635Recorded: 06/16/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/12/2018
Assignee:
2200 WEST SALZBURG ROAD
MIDLAND, MICHIGAN 48686-0994
Correspondent:
BARB PROSS
2211 H.H. DOW WAY
MIDLAND, MI 48674

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