Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/27/2021
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Application #:
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16785248
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Filing Dt:
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02/07/2020
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Inventors:
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Ying-Chih HSU, Alan ROTH, Chuei-Tang WANG, Chih-Yuan CHANG, Eric SOENEN, Chih-Lin CHEN
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Title:
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HEAT TRANSFER STRUCTURES AND METHODS FOR IC PACKAGES
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300 |
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HAUPTMAN HAM, LLP (TSMC) |
2318 MILL ROAD |
SUITE 1400 |
ALEXANDRIA, VA 22314 |
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05/24/2024 04:15 PM
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