Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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15808612
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Filing Dt:
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11/09/2017
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Publication #:
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Pub Dt:
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06/21/2018
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Inventors:
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Hyun-Gyung KIM, Dong-Eun CHA, Dae-Jung KIM, Jin-Young YOON
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Title:
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Three-Dimensional Cooling Type Hot-Stamping Method and System and Vehicle Structural Member Manufactured by the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12, HEOLLEUNG-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 137-938 |
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| 12, HEOLLEUNG-RO, SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 137-938 |
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| 2-9, NONGGONG-GIL, JEONGGWAN-EUP |
| GIJANG-GUN |
| BUSAN, KOREA, REPUBLIC OF 46020 |
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| MORGAN, LEWIS & BOCKIUS LLP (SF) |
| ONE MARKET, SPEAR STREET TOWER, SUITE 28 |
| SAN FRANCISCO, CA 94105 |
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