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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11080453
Issue Dt:
08/03/2021
Application #:
16599552
Filing Dt:
10/11/2019
Publication #:
20200134122
Pub Dt:
04/30/2020
Inventors:
Sheng-Hsiung CHEN, Fong-Yuan CHANG, Li-Chun TIEN, Po-Hsiang HUANG, Chih-Hsin KO et al
Title:
INTEGRATED CIRCUIT FIN LAYOUT METHOD, SYSTEM, AND STRUCTURE
Assignment: 1
Reel/Frame:
051064/0099Recorded: 11/20/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HUANG, PO-HSIANG
Exec Dt:
10/15/2019
CHEN, SHENG-HSIUNG
Exec Dt:
10/15/2019
KO, CHIH-HSIN
Exec Dt:
10/21/2019
CHANG, FONG-YUAN
Exec Dt:
10/15/2019
WANN, CLEMENT HSINGJEN
Exec Dt:
10/22/2019
TIEN, LI-CHUN
Exec Dt:
10/25/2019
HSU, CHIA-MING
Exec Dt:
10/23/2019
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
HAUPTMAN HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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