Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/10/2021
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Application #:
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16717461
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Filing Dt:
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12/17/2019
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Inventors:
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Shih-Ming Chang, Ru-Gun Liu, Chung-Ju Lee, Shau-Lin Shue, Chih-Ming Lai, Tsai-Sheng Gau et al
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Title:
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Via Connection to a Partially Filled Trench
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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HAYNES AND BOONE, LLP (24061) IP SECTION |
2323 VICTORY AVENUE |
SUITE 700 |
DALLAS, TX 75219 |
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05/28/2024 10:34 AM
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