Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/10/2021
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Application #:
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16396992
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Filing Dt:
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04/29/2019
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Publication #:
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Pub Dt:
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10/29/2020
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Inventors:
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Joshua M. Rubin, Jared Barney Hertzberg, Vivekananda P. Adiga, Markus Brink et al
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Title:
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THROUGH-SILICON-VIA FABRICATION IN PLANAR QUANTUM DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM YOR IPLAW (GLF) C/O GARG LAW FIRM, P |
| 10701 CORPORATE DR., SUITE 230 |
| RICHMOND, TX 77477 |
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