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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11091630
Issue Dt:
08/17/2021
Application #:
16333082
Filing Dt:
03/13/2019
Publication #:
20190270881
Pub Dt:
09/05/2019
Inventors:
Chang Bo SHIM, Hyun Sung MIN, Seung Hyun SONG, Hee Yong SHIM, Young Chan KIM
Title:
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG, AND METAL CLAD LAMINATE USING THE SAME
Assignment: 1
Reel/Frame:
048595/0258Recorded: 03/14/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SHIM, CHANG BO
Exec Dt:
02/13/2019
SHIM, HEE YONG
Exec Dt:
02/13/2019
MIN, HYUN SUNG
Exec Dt:
02/13/2019
KIM, YOUNG CHAN
Exec Dt:
02/13/2019
SONG, SEUNG HYUN
Exec Dt:
02/13/2019
Assignee:
LG CHEM, LTD.
128, YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07336
Correspondent:
DENTONS US LLP
1900 K. STREET, N.W.
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
049157/0895Recorded: 04/02/2019Pages: 8
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ATTORNEY DOCKET NUMBER PREVIOUSLY RECORDED AT REEL: 048595 FRAME: 0258. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
SHIM, CHANG BO
Exec Dt:
02/13/2019
SHIM, HEE YONG
Exec Dt:
02/13/2019
MIN, HYUN SUNG
Exec Dt:
02/13/2019
KIM, YOUNG CHAN
Exec Dt:
02/13/2019
SONG, SEUNG HYUN
Exec Dt:
02/13/2019
Assignee:
LG CHEM, LTD.
128, YEOUI-DAERO, YEONGDEUNGPO-GU
SEOUL, KOREA, REPUBLIC OF 07336
Correspondent:
DENTONS US LLP
1900 K STREET NW
WASHINGTON DC, DC 20006

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