Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16748559
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Filing Dt:
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01/21/2020
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Publication #:
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Pub Dt:
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07/22/2021
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Inventors:
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Fan-Yu MIN, Chen-Hung LEE, Hsiu-Chi LIU, Liang-Chun CHEN
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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FOLEY & LARDNER LLP |
3000 K STREET, N.W. |
SUITE 600 |
WASHINGTON, DC 20007 |
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09/26/2024 06:47 AM
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