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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/17/2021
Application #:
16645166
Filing Dt:
03/06/2020
Publication #:
Pub Dt:
09/24/2020
Inventors:
David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
Title:
HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION COOLING
Assignment: 1
Reel/Frame:
052182/0275Recorded: 03/17/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/03/2020
Exec Dt:
03/04/2020
Exec Dt:
03/09/2020
Exec Dt:
03/03/2020
Exec Dt:
03/02/2020
Assignee:
AMP TECHNOLOGY CENTRE
BRUNEL WAY, ROTHERHAM
SOUTH YORKSHIRE, UNITED KINGDOM S60 5WG
Correspondent:
MORRIS & KAMLAY LLP
1911 FORT MYER DRIVE
SUITE 1050
ARLINGTON, VA 22209

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